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- 4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper. Mingxing Tang, Shengtao Zhang, Yujie Qiang, Shijin Chen, Li Luo, Jingyao Gao, Li Feng, Zhongjian Qin
, RSC Adv.
, 2017
, 7
, 40342
- 1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia. Xulingjie Teng, Zhihua Tao, Zhiyuan Long, Guanting Liu, Xuefei Tao
, RSC Adv.
, 2022
, 12
, 16153